NDLI: Environmentally advantageous industrial processes based on pulsed power technology

Content Provider	IEEE Xplore Digital Library
Author	Hartmann, W. Rohde, K.-D.
Copyright Year	2001
Description	Author affiliation: Corporate Technol., Siemens AG, Erlangen, Germany (Hartmann, W.; Rohde, K.-D.)
Abstract	The application of intense pressure pulses on two industrially interesting applications, i.e. noncontact, ultra-pure milling/deagglomeration of powders, end noncontact removal of SMD parts from printed circuit boards, is presented, including threshold process parameters. The grinding efficiency of powders (in terms of decreasing particle mean diameter per unit energy consumed) increases strongly above a threshold pressure, indicating that a further decrease of the measured specific energy consumption of this process is feasible. Application of a series of shocks to cemented or soldered SMD connections results in crack formation and propagation within the bond region, and eventually to the removal of the SMD part itself. Processing is done in a liquid environment (i.e., degassed water, silicon oil or hydrocarbons like alcohols), and can be used for either parts recycling, PCB repair, or process control in terms of online bond quality evaluation. Initial results are given concerning threshold parameters for soldered connections. This process opens up a vast field of applications, in particular in the area of rapid on-line testing and quality control in a variety of industrial processes.
Sponsorship	Plasma Sci. & Appl. Committee Pulsed Power Sci. & Technol. Committee of the IEEE Nucl. & Plasma Sci. Soc
Starting Page	216
Ending Page	219
File Size	405745
Page Count	4
File Format	PDF
ISBN	0780371208
DOI	10.1109/PPPS.2001.1002031
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-06-17
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Powders Bonding Pulse circuits Milling Printed circuits Energy measurement Particle measurements Pressure measurement Energy consumption Electric shock
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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