NDLI: Composites with nanosilica

Content Provider	IEEE Xplore Digital Library
Author	Harvanek, L. Tomaskova, T. Svoboda, M. Mentlik, V.
Copyright Year	2015
Description	Author affiliation: Dept. of Technol. & Meas., Univ. of West Bohemia, Pilsen, Czech Republic (Harvanek, L.; Tomaskova, T.; Svoboda, M.; Mentlik, V.)
Abstract	There are only a few materials that are promising composites. For decades high-voltage electrical insulation technology used ternary insulation systems; usually based on modified epoxy resins and reconstructed mica. Adding additional components into existing systems, it is possible to influence their properties. However, the disadvantage is an inhomogeneous composite structure that emerges from the very quality of these materials. Inhomogeneous structure material causes defects during operation that increase material and this can limit the life of the entire device. The key to solving this problem is to reduce the dimensions of the individual components, in this case the filler. This paper deals with the study of electrical insulation properties of nanocomposites based on epoxy resin filled with hydrophobic and hydrophilic silica. Nanocomposities were created by using a dissolution method, in which a nanofiller was applied to the melted matrix DGEBA. We made a special mould to cure the samples. To determine the electrical insulating properties the following characteristics were measured: polarization index, volume resistivity, dissipation factor and dielectric strength. The aim of this study is to demonstrate that hydrophobic silica combined with water with little or no hydrogen bonds will have better electrical properties than hydrophobic silica on its own. The results show that the best results were achieved with 1% hydrophobic silica.
Starting Page	844
Ending Page	847
File Size	2509947
Page Count	4
File Format	PDF
ISSN	21609241
e-ISBN	9781479989034
DOI	10.1109/ICPADM.2015.7295404
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-07-19
Publisher Place	Australia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon compounds Conductivity Epoxy resins Thermal conductivity Temperature measurement Dielectric measurement dielectric properties insulation system composite resin hydrophilic nanosilica hydrophobic nanosilica thermal conductivity
Content Type	Text
Resource Type	Article

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