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Content Provider | IEEE Xplore Digital Library |
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Author | Akturk, A. Goldsman, N. Dilli, Z. Peckerar, M. |
Copyright Year | 2006 |
Description | Author affiliation: Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD (Akturk, A.; Goldsman, N.; Dilli, Z.; Peckerar, M.) |
Abstract | As electronics that can work in space find wider applications, the modeling of devices that can efficiently operate under extreme conditions has been gaining great importance. Thus, we present a methodology for determining device performance details at cryogenic temperatures in conjunction with chip and package details. Using our technique that takes into account package thermal resistances and generated heat, we obtain possible temperature operating conditions for a device used in space applications. Moreover, to enable device operation at higher temperatures that would result in higher transconductances and operating speeds, we also offer methods for initial temperature boosting using heat kick-start circuits |
Sponsorship | IEEE Electron Devices Soc |
Starting Page | 240 |
Ending Page | 243 |
File Size | 4193642 |
Page Count | 4 |
File Format | |
ISBN | 1424404045 |
DOI | 10.1109/SISPAD.2006.282880 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2006-09-06 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Cryogenics Space heating Poisson equations Circuits Electronic packaging thermal management Thermal resistance Temperature distribution Electronics packaging Resistance heating Heat engines chip modeling Cryogenic temperatures self-heating device modeling |
Content Type | Text |
Resource Type | Article |
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