NDLI: Application of technology CAD in process development for high performance logic and system-on-chip in IC foundry

Content Provider	IEEE Xplore Digital Library
Author	Liew, B.K. Wang, C.C. Diaz, C.H. Wu, S.Y. Sun, Y.C. Lin, Y.F. Kuo, D.S. Lin, H.T. Yen, A.
Copyright Year	1999
Description	Author affiliation: Taiwan, Hsinchu, Taiwan (Liew, B.K.)
Abstract	In recent years, IC foundry leaders such as TSMC have invested heavily in leading edge process technologies. These technologies are developed to meet market demand from fabless, integrated device manufacturers as well as system companies. The application spectrum spans high performance logic/mixed-mode processes used in fabricating microprocessors, DSP's, and also embedded memory technologies that enable system-on-chip designs such as logic/mixed mode IC's with integrated SRAM, DRAM, nonvolatile memories. The use of TCAD tools is imperative to accelerate the development of these processes, meet high performance targets, ensure process compatibility and manufacturability, minimize development cost especially for embedded memory technologies. This paper gives an overview of TCAD application in process development within TSMC R&D. The challenges of using TCAD tools in the IC foundry will also be discussed.
Starting Page	3
Ending Page	6
File Size	396529
Page Count	4
File Format	PDF
ISBN	4930813980
DOI	10.1109/SISPAD.1999.799245
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-09-06
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Japan Soc. Of Appl. Physics
Subject Keyword	Foundries Logic devices Logic design Random access memory Manufacturing Microprocessors Digital signal processing System-on-a-chip Application specific integrated circuits Nonvolatile memory
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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