NDLI: Numerical aspects of temperature profile reconstruction using acoustic tomography in RTP

Content Provider	IEEE Xplore Digital Library
Author	Cho, Y.M. Dankoski, P. Pati, Y.C. Xu, G. Kailath, T.
Copyright Year	1993
Description	Author affiliation: Dept. of Electr. Eng., Stanford Univ., CA, USA (Cho, Y.M.; Dankoski, P.; Pati, Y.C.)
Abstract	Precise wafer temperature control is crucial to the viability of the emerging technology of rapid thermal processing (RTP) for semiconductor manufacturing. The authors examine the problem of accurate noninvasive measurement of wafer temperature, which is required for precise temperature control. The paper extends the work of Khuri-Yakub et al. (1993) on acoustic techniques for noninvasive wafer temperature measurement. The authors propose a method for estimation of wafer temperatures via regularized tomographic inversion using a priori knowledge of properties of the temperature distribution and data obtained by their technique. Results of simulation studies of the methods proposed are described.
Starting Page	149
Ending Page	153
File Size	457588
Page Count	5
File Format	PDF
ISBN	0818641207
ISSN	10586393
DOI	10.1109/ACSSC.1993.342488
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1993-11-01
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature control Temperature measurement Temperature distribution Rapid thermal processing Manufacturing processes Semiconductor device manufacture Noninvasive treatment Tomography
Content Type	Text
Resource Type	Article
Subject	Signal Processing Computer Networks and Communications

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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