NDLI: Fully physical time-dependent compact thermal modelling of complex non linear 3-dimensional systems for device and circuit level electro-thermal CAD

Content Provider	IEEE Xplore Digital Library
Author	Batty, W. Christoffersen, C.E. David, S. Panks, A.J. Johnson, R.G. Snowden, C.M. Steer, M.B.
Copyright Year	2001
Description	Author affiliation: Inst. of Microwaves & Photonics, Leeds Univ., UK (Batty, W.)
Abstract	An fully analytical spectral domain decomposition approach to solution of the nonlinear time-dependent heat diffusion equation in complex volumes is introduced. Its application to device/circuit level electro-thermal simulation on CAD timescales is illustrated. The full treatment in coupled electro-thermal CAD of thermal nonlinearity due to temperature dependent diffusivity is described. Thermal solutions are presented in the form of thermal impedance matrix expressions for thermal subsystems. These include double Fourier series solutions for rectangular multilayers, which are an order of magnitude faster to evaluate than existing semi-analytical Fourier solutions based on DFT-FFT. They also include double Fourier series solutions for arbitrarily distributed volume heat sources and sinks, constructed without use of Green's function techniques, and for rectangular volumes with prescribed fluxes on all faces. These analytical solutions allow treatment of arbitrary device structures without invoking conventional numerical methods. They provide minimal boundary condition independent compact thermal models, allowing CAD timescale coupled electro-thermal solution for complex systems, without requiring lumped element RC network extraction or node reduction. The time-independent thermal resistance matrix description of device structure is illustrated by a fully physical, coupled electro-thermal study of the interaction of substrate thickness and surface convection in power HEMTs. The thermal time-dependent implementation is illustrated by circuit level harmonic balance simulation of a 3/spl times/3 MMIC amplifier array.
Sponsorship	IEEE Components, Packaging, Manuf. Technol. Soc
Starting Page	71
Ending Page	84
File Size	1848441
Page Count	14
File Format	PDF
ISBN	0780366492
DOI	10.1109/STHERM.2001.915149
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-03-22
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Circuit simulation Coupling circuits Fourier series Thermal resistance Surface resistance Spectral analysis Nonlinear equations Temperature dependence Impedance Nonhomogeneous media
Content Type	Text
Resource Type	Article

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