NDLI: Concepts for high packaging and integration efficiency

Content Provider	IEEE Xplore Digital Library
Author	Popovic, J. Ferreira, J.A.
Copyright Year	2004
Description	Author affiliation: Electr. Eng., Mathematics & Comput. Sci., Delft Univ. of Technol., Netherlands (Popovic, J.; Ferreira, J.A.)
Abstract	Current packaging technology in power electronics is based on assembling pre-manufactured discrete components. Each component consists of a number of parts, manufactured in a variety of manufacturing processes. This has resulted in a diversity of different parts and mutually incompatible manufacturing processes in a typical power electronic converter and has brought power electronics to the edge where it becomes extremely difficult to reduce the cost and size of power electronic converters. In this paper, we present a way to improve packaging of power electronic converters by increasing integration level and using multifunctional construction parts. Two quantities (K/sub l/ and K/sub p/) intended to evaluate integration level in power converters are introduced. Based on these values, a number of methods to increase the integration level are presented. These methods are then applied to a DC/DC 42/14 V converter for automotive applications. Three packaging concepts, namely lead frame converter, PCB embedded converter and heat conductor converter are proposed. They are compared to a benchmark converter implemented in the conventional discrete packaging technology. It is shown that by smart use of parts in the converter construction, the high values of integration level and high power densities can be achieved.
Sponsorship	IEEE Power Electon. Soc
Starting Page	4188
Ending Page	4194
File Size	657024
Page Count	7
File Format	PDF
ISBN	0780383990
ISSN	02759306
DOI	10.1109/PESC.2004.1354740
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-20
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Power electronics Electronics packaging Manufacturing processes Electric breakdown Electronic packaging thermal management Semiconductor device packaging Mathematics Computer science Components, packaging, and manufacturing technology Assembly
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in