NDLI: A discussion of a GaAs MCM fabricated at MicroModule Systems through the multichip module designers' access service (MIDAS)

Content Provider	IEEE Xplore Digital Library
Author	Peltier, J. Hansford, W. Gauthier, C. Lomax, R. Nauna, M. Parakh, P. Stetson, S.
Copyright Year	1997
Description	Author affiliation: Information Sci. Inst., Marina del Rey, CA, USA (Peltier, J.)
Abstract	The MCM Designers' Access Service (MIDAS) allows designers to obtain low cost, prototype and small quantities of MCMs. MIDAS low cost price structure comes from a multi-project environment where the customers share tooling and substrate manufacturing costs. The service acts as a technology enabler by supplying the designer with an interface "transparent" to the fabricator and common to multiple vendors. By completing front-end foundry tasks such as data preparation and mask fabrication and by grouping multiple users together on a run, MIDAS offers a low-cost prototype and small quantity service. Utilization of certain design guidelines module footprint size and I/O ring, layer stacking and number of layers and MIDAS supplied standard packages allow the user ample flexibility when designing a module and provides a comprehensive design environment. To date, MIDAS has accepted designs from commercial, military, and educational/research institutions. This paper presents an example of a module that pushes the current MCM-D technology to an extreme limit. The design was done at the University of Michigan and fabricated at MicroModule Systems in Cupertino, CA. It represents a joint design effort amongst the University of Michigan, Motorola, and Cascade Design Automation. It includes a selection of Mayo Foundation Standard Test Structures and six custom designed CGaAs chips fabricated by Motorola. This module is a technology evaluation vehicle that aims to characterize the MCM interconnect and driver-receiver pairs for signal integrity, and evaluate the design methodology in Motorola CGaAs (tm). A clock generator drives two pairs of serial-to-parallel and parallel-to-serial shift-registers at frequencies up to 1 GHz. One chip controls an unterminated databus which will be probed at one end. This MCM is the first of three MCM designs planned in the development of a 1 GHz clock processor which will execute a subset of the PowerPC (tm) instruction set selected to optimize performance in GaAs. This paper discusses MIDAS' role in fabricating and assembling the module, the design effort among the parties listed above and the module's functionality.
Starting Page	43
Ending Page	47
File Size	628359
Page Count	5
File Format	PDF
ISBN	0780337875
DOI	10.1109/ICMCM.1997.581144
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-04-02
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Gallium arsenide Costs Prototypes Clocks Manufacturing Foundries Fabrication Guidelines Stacking Packaging
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Flexible access to MCM technology via the multichip module designers' access service (MIDAS)

The ARPA (ASEM) MCM brokerage service

Implementation of a MCM brokerage service

Prototype development of flip chip MCMs

Low cost, prototype ASIC and MCM fabrication and assembly from the MOSIS service

Packaging of GaAs signal processors on multichip modules

Comparison of multichip module technologies for the electronic packaging-of high clock digital signal processors

GaAs multichip module for a parallel processing system

MMIC GaAs Foundry in Israel

A discussion of a GaAs MCM fabricated at MicroModule Systems through the multichip module designers' access service (MIDAS)

Similar Documents

Flexible access to MCM technology via the multichip module designers' access service (MIDAS)

The ARPA (ASEM) MCM brokerage service

Implementation of a MCM brokerage service

Prototype development of flip chip MCMs

Low cost, prototype ASIC and MCM fabrication and assembly from the MOSIS service

Packaging of GaAs signal processors on multichip modules

Comparison of multichip module technologies for the electronic packaging-of high clock digital signal processors

GaAs multichip module for a parallel processing system

MMIC GaAs Foundry in Israel

A discussion of a GaAs MCM fabricated at MicroModule Systems through the multichip module designers' access service (MIDAS)