NDLI: Packaging of GaAs signal processors on multichip modules

Content Provider	IEEE Xplore Digital Library
Author	Gilbert, B.K. Pan, G.W.
Copyright Year	1978
Abstract	The extensions that must be made to the deposited multichip module (MCM-D) fabrication technology and to the design and layout of these structures in order to accommodate high clock rate ECL and GaAs digital integrated circuits are discussed. Techniques for attachment of the high clock rate chips to the MCM-Ds are discussed, including wire bond, tape automated bond (TAB), flip-chip solder attachment, and flip adhesives. The tradeoffs between these different approaches are noted. Electrical issues are addressed. The problem of launching fast rise time, wide bandwidth signals onto and retrieving such signals from the MCM-Ds are noted. The thermal problems associated with the packing of 10-50 high power dissipation chips onto such small structures are discussed, along with methods of removing such high levels of heat by changes in materials incorporated into the stacked structures. Several MCM-D design and fabrication projects under way which attempt to address and solve some of the problems are described, along with some of the initial results of these studies.<>
Sponsorship	IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page	15
Ending Page	28
Page Count	14
File Size	1462121
File Format	PDF
ISSN	01486411
Volume Number	15
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1992-02-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Gallium arsenide Signal processing Multichip modules Fabrication Clocks Bonding Integrated circuit packaging Integrated circuit technology Digital integrated circuits Wire
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

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