NDLI: Thermal management for multifunctional structures [spacecraft electronics]

Content Provider	IEEE Xplore Digital Library
Author	Rawal, S.P. Barnett, D.M. Martin, D.E.
Copyright Year	1998
Description	Author affiliation: Lockheed Martin Astronautics, Denver, CO, USA (Rawal, S.P.)
Abstract	Multifunctional structures (MFS) are an innovative concept that offer a new methodology for spacecraft design, by eliminating chassis, cables and connectors, and integrating the electronics into the walls of the spacecraft. The MFS design consists of multilayer flexible circuit patches bonded onto a structural composite panel, and multichip modules (MCMs) performing specific functions are bonded on to the circuit patches, which are interconnected via flexible circuit jumpers. Incorporation of the high power density 2D and 3D MCMs into smaller and more efficient packaging designs still has the fundamental requirement to maintain component temperatures within design limits. Higher component qualification temperatures, such as 393 K, can result in smaller spacecraft radiator areas that are consistent with efficient packaging schemes. During the MFS development effort, a structural radiator panel was fabricated using high thermal conductivity (hi-K) composite facesheets, and several thermal management designs using combinations of hi-K doublers (150-1500 W/m-K), hi-K (150-700 W/m-K) corefill, and deployable radiators to maximize MCM heat rejection. Results of thermal vacuum tests and details of the thermal design methodology are presented in this paper.
Starting Page	129
Ending Page	134
File Size	733117
Page Count	6
File Format	PDF
ISBN	0780348508
DOI	10.1109/ICMCM.1998.670767
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-04-17
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal management Space vehicles Flexible printed circuits Electronic packaging thermal management Thermal conductivity Design methodology Bonding Temperature Thermal management of electronics Cables
Content Type	Text
Resource Type	Article

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