NDLI: Broadband transition from dielectric-filled to air-filled Substrate Integrated Waveguide for low loss and high power handling millimeter-wave Substrate Integrated Circuits

Content Provider	IEEE Xplore Digital Library
Author	Parment, F. Ghiotto, A. Tan-Phu Vuong Duchamp, J.-M. Ke Wu
Copyright Year	2014
Description	Author affiliation: Poly-Grames Res. Center, Ecole Polytech. de Montreal, Montreal, QC, Canada (Ke Wu) \|\| IMS Lab., Univ. of Bordeaux, Talence, France (Ghiotto, A.) \|\| IMEP-LAHC Lab., Univ. of Grenoble Alpes, Grenoble, France (Parment, F.; Tan-Phu Vuong; Duchamp, J.-M.)
Abstract	Air-filled Substrate Integrated Waveguide (SIW) based on multilayer Printed Circuit Board (PCB) process is proposed in this paper for millimeter-wave applications that require low cost, high performances and compactness. This air-filled SIW allows for substantial loss reduction and power handling enhancement. Its fabrication involves three layers. The top and bottom substrates can consist of a low cost standard substrate such as FR-4 on which base-band or digital circuits can be implemented so to obtain a very compact, high performance and low cost millimeter-wave system. At Ka-band, it is shown that air-filled SIW compared to dielectric-filled SIW based on Rogers RT/Duroid 5880 and 6002 reduces losses by a mean value of 0.054 dB/cm and 0.11 dB/cm and increases average power handling capability by 6 dB and 8 dB, respectively. To allow interconnects of the proposed air-filled SIW with dielectric-filled SIW, a broadband transition is presented. The design steps of this transition are detailed. For demonstration purposes, a back-to-back transition operating over the Ka-band is fabricated. It achieves a matching of better than -15 dB and an insertion loss of 0.6 ±0.2 dB (0.3 ±0.1 dB for the transition) from 27 to 40 GHz.
Sponsorship	IEEE Microwv. Theory Tech. Soc.
Starting Page	1
Ending Page	3
File Size	951503
Page Count	3
File Format	PDF
ISBN	9781479938698
DOI	10.1109/MWSYM.2014.6848524
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Dielectric measurement Power measurement Silicon Substrates Dielectrics Conductors wideband transition Millimeter-wave power handling capability substrate integrated waveguide (SIW)
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in