NDLI: An LCP packaged high-power, high-efficiency CMOS millimeter-wave oscillator

Content Provider	IEEE Xplore Digital Library
Author	Juntunen, E. Khan, W. Patterson, C. Bhattacharya, S. Dawn, D. Laskar, J. Papapolymerou, J.
Copyright Year	2011
Description	Author affiliation: Georgia Institute of Technology, School of Electrical and Computer Engineering, Atlanta, 30332, U.S.A. (Juntunen, E.; Khan, W.; Patterson, C.; Bhattacharya, S.; Dawn, D.; Laskar, J.; Papapolymerou, J.)
Abstract	This paper, for the first time, demonstrates the performance of a CMOS millimeter-wave oscillator packaged on low-cost, organic liquid crystal polymer (LCP). The oscillator is embedded in a laser-ablated cavity and then its GSG pads are wire bonded to CPW lines on LCP substrate. Measurements were taken of the bare-die oscillator and the packaged oscillator in order to verify the effects of the wire bonding and LCP packaging. The oscillator achieves a peak output power of +4.6 dBm when measured on wafer and +4.2 dBm when measured on package. Peak DC to RF efficiencies of 11.54% and 9.89% are measured for the unpackaged and packaged cases, respectively. These output powers and efficiencies are the highest reported to date for a packaged or unpackaged millimeter-wave CMOS oscillator to the best of the authors' knowledge. The tunable frequencies are 41.08–42.87 GHz and 41.32–42.60 GHz for the unpackaged and packaged oscillator, respectively. Simulations are also performed to investigate an on-package compensation technique to mitigate the effects of the packaging on the oscillator performance.
Starting Page	1
Ending Page	4
File Size	681512
Page Count	4
File Format	PDF
ISBN	9781612847542
ISSN	0149645X
e-ISBN	9781612847573
e-ISBN	9781612847566
DOI	10.1109/MWSYM.2011.5972972
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-06-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Oscillators CMOS integrated circuits Millimeter wave technology Wires Packaging Substrates Semiconductor device modeling Class-E LCP CMOS Millimeter-Wave VCO High-Efficiency
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electrical and Electronic Engineering Radiation

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