NDLI: Novel multiport probing fixture for high frequency measurements in dense via arrays

Content Provider	IEEE Xplore Digital Library
Author	Kwark, Y.H. Kotzev, M. Baks, C. Xiaoxiong Gu Schuster, C.
Copyright Year	2011
Description	Author affiliation: Technische Universitaet Hamburg-Harburg (TUHH), Germany (Kotzev, M.; Schuster, C.) \|\| IBM T.J. Watson Research Center Yorktown Heights, New York, USA (Kwark, Y.H.; Baks, C.; Xiaoxiong Gu)
Abstract	In this paper the authors present a novel multiport probing fixture for high frequency measurements of dense via arrays. The probing fixture consists of a 36 mm by 36 mm multilayer printed circuit board plugged into an LGA socket clamped down to the device under test using custom hardware. The test signal is launched from top surface mounted coaxial connectors and fanned in with striplines to a 1 mm via pitch on the bottom side. Custom calibration substrates are used to deembed the probing fixture from measurements by applying multiport deembedding techniques. The effect of contact pressure on obtaining reproducible measurements is investigated.
Starting Page	1
Ending Page	4
File Size	1511807
Page Count	4
File Format	PDF
ISBN	9781612847542
ISSN	0149645X
e-ISBN	9781612847573
e-ISBN	9781612847566
DOI	10.1109/MWSYM.2011.5972758
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-06-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Power measurement Fixtures Sockets Substrates Frequency modulation VNA multiport measurements printed circuit board probing fixture two-tier calibration via arrays
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electrical and Electronic Engineering Radiation

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