NDLI: Failure analysis for metal bridge defect in logic area of mixed-signal IC

Content Provider	IEEE Xplore Digital Library
Author	Diwei Fan Wang, W.
Copyright Year	2014
Description	Author affiliation: Product Anal. Eng. of Quality Dept., Freescale Semicond. (China) Ltd., Tianjin, China (Diwei Fan; Wang, W.)
Abstract	In mixed-signal ICs the die surface is divided between the analog circuit and the digital circuit often referred to as the logic area. Compare with the analog area, the logic area has more complex signals. The metal lines are narrower and closer together. These factors make it very hard to analyze defects such as metal bridges in the logic area. Firstly, the complicated waveform of signals and circuit loops in logic area make the schematic analysis harder. We cannot find the failed signal only through the comparison between reference unit and failed unit. The reason is that in the complicated circuit loop, one signal failure can cause many other signals in the circuit loop to fail. Secondly, if the failed signal is caused by metal bridge defect, since there are many metal lines close to the failed signal metal bridges to several of the metal lines could be the cause of failure. In this paper, we show how many FA techniques such as emission microscopy, microprobe, function, OBIRCH, FIB etc need to be used can be used to find a metal bridge defect causing a failure in the logic area.
Starting Page	42
Ending Page	45
File Size	5210198
Page Count	4
File Format	PDF
ISBN	9781479939312
ISSN	19461542
e-ISBN	9781479939299
DOI	10.1109/IPFA.2014.6898124
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-06-30
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Metals Bridge circuits Logic circuits Failure analysis Photonics Integrated circuits Inverters Logic circuit area Mixed-signal IC metal bridge defect
Content Type	Text
Resource Type	Article

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