NDLI: Application of EDS Technique for OSP Film Thickness Measurement

Content Provider	IEEE Xplore Digital Library
Author	Prong, K. Sirarat, K.
Copyright Year	2006
Description	Author affiliation: Spansion Ltd., Pakkret (Prong, K.; Sirarat, K.)
Abstract	Nowadays, there are numbers of pad finishing types in market for ball grid array package (BGA). OSP (organic solderability preservatives) pad finishing technology is one of the most widely used for the purpose of increasing the joint strength and achieving more excellence in heat-resistance. Especially, to develop the ICs products to have compatibility with non-clean soldering fluxes and solder paste as well as lead-free solder, OSP becomes one most suggested. Spansion with the commitment to customer requirements, has to implement OSP pad in our products i.e. FBGA packages. OSP pad is one of pad finishing technologies that Cu pad is coated with the thin film of a kind of organic material to protect Cu from oxidation during storage and many processes in IC manufacturing. The thickness the OSP film coated over Cu layer is in order of micrometer. Normally, during solder ball attachment process OSP will be cleaned out by soldering flux and heat to allow Cu to expose and attach to solder ball. The point is that if the thickness of OSP is too thin (less than 0.12 micron), the film cannot prevent copper from oxidation during storage and heat cycles. On the other hand, if the OSP film is too thick (more than 0.4 micron), OSP will not be perfectly cleaned out by flux during soldering reflow process. Hence this will bring to the bad solder joint because the presence of some OSP residue can result in bad solder wetting. This can affect on the attachment of solder ball and finally lead to significantly weak solder joint. Therefore, thickness of OSP film is one of the most critical factors that we have to consider and control in order to achieve desirable joint strength. Without OSP thickness information we will be unable to be confident in the quality of our product and unable to control incoming quality of substrate from supplier site. So, it is highly necessary to measure the OSP thickness or at least for monitoring and analysis purposes
Starting Page	200
Ending Page	204
File Size	3381996
Page Count	5
File Format	PDF
ISBN	1424402050
DOI	10.1109/IPFA.2006.251030
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-07-03
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thickness measurement Soldering Copper Finishing Packaging Environmentally friendly manufacturing techniques Lead Oxidation Material storage Thickness control
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in