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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Krenik, W. Staszewski, R.B. |
| Copyright Year | 2006 |
| Description | Author affiliation: Texas Instrum. Inc., Dallas, TX (Krenik, W.; Staszewski, R.B.) |
| Abstract | The market for cellular wireless handsets demands very high levels of sophistication and also low component cost and power. In addition to wide-area network interfaces such as GPRS, EDGE, and WCDMA, wireless connectivity features such as GPS, Bluetooth, WLAN, and mobile digital TV are now becoming commonplace. This has driven the demand for many air interfaces to be supported in a single handset design. Conventional silicon integration, employing separate digital baseband, analog, and RF components for each air interface would result in far too many components for an efficient integration. As a result, CMOS SOC devices that integrate all of these functions into single-chip components have become increasingly popular. This paper explains the motivation and challenges of SOC integration in deep submicron CMOS. Examples of SOC devices are provided along with experimental results. |
| Starting Page | 1795 |
| Ending Page | 1802 |
| File Size | 1828464 |
| Page Count | 8 |
| File Format | |
| ISBN | 9784902339086 |
| DOI | 10.1109/APMC.2006.4429758 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2006-12-12 |
| Publisher Place | Japan |
| Access Restriction | Subscribed |
| Rights Holder | IEICE of Japan |
| Subject Keyword | Radio frequency Transceivers Telephone sets Costs Network interfaces Ground penetrating radar Multiaccess communication Global Positioning System Bluetooth Wireless LAN |
| Content Type | Text |
| Resource Type | Article |
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