NDLI: Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias

Content Provider	IEEE Xplore Digital Library
Author	Posada, G. Carchon, G. Soussan, P. Pham, N. Majeed, B. Sabuncouglu, D. Ruythooren, W. Nauwelaers, B. De Raedt, W.
Copyright Year	2007
Description	Author affiliation: IMEC, Heverlee (Posada, G.; Carchon, G.; Soussan, P.; Pham, N.; Majeed, B.; Sabuncouglu, D.; Ruythooren, W.)
Abstract	The integration of through-substrate vias on 100 mum thick high-resistivity silicon (HRSi) wafers within the thin-film multi-chip module technology (MCM-D) is demonstrated in this paper. High quality integrated lumped elements such as thin-film resistors, capacitors and inductors are demonstrated on a microstrip configuration within an MCM-D technology. Microstrip lines integrated on the thin HRSi present a quality factor 2.5 times higher than CPW lines with similar dimensions on AF45 glass, highlighting the advantages of using microstrip type of circuits. High-quality distributed-element bandpass filters at 30 GHz are presented proving the ability of the technology to integrate high frequency circuits as well. Being able to integrate high quality passive components at various frequencies, it is a powerful technology platform for the integration of high performance system in a package (SiP) modules.
Starting Page	1133
Ending Page	1136
File Size	359800
Page Count	4
File Format	PDF
ISBN	9782874870019
DOI	10.1109/EUMC.2007.4405398
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-10-09
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	European Microwave Association
Subject Keyword	Microstrip Semiconductor thin films Silicon Thin film inductors Integrated circuit technology Frequency Thin film circuits Resistors Capacitors Q factor integrated passive device High-resistivity silicon system in a package (SiP) MCM-D thin-film microstrip
Content Type	Text
Resource Type	Article

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