NDLI: Characteristics of Ni electroformed micro connector used for high density packaging

Content Provider	IEEE Xplore Digital Library
Author	Unno, T. Toriyama, T. Isono, Y. Sugiyama, S.
Copyright Year	2004
Description	Author affiliation: Grad. Sch. of Sci. & Eng., Ritsumeikan Univ., Shiga, Japan (Unno, T.)
Abstract	This study describes that a micro connector has been produced by the combination use of UV thick resist as well as the lithography and the electroforming, and has been evaluated. The fabricated connector has 100 pins with 80 /spl mu/m pitch. The size of the terminal of fabricated micro connector was 50 /spl mu/m - thickness and 15 /spl mu/m - width (minimum). The maximum aspect ratio of the fabricated micro connector is 33 and the terminal pitch is 80 /spl mu/m. As the evaluation of its specific properties, contact force, contact resistance, Young's modulus and permissible current have been determined. The contact force is 3.3 mN at 5 /spl mu/m of the displacement of the socket terminal. The contact resistance among terminals is shown less than 50 m/spl Omega/ by using four point probe method. The determination of Young's modulus of Ni structure is found to be 180 GPa by using SPM method. The designed connector treated by Au plating has indicated the possibility to obtain the stable electric contact after the durability test.
Starting Page	105
Ending Page	108
File Size	1688432
Page Count	4
File Format	PDF
ISBN	0780386078
DOI	10.1109/MHS.2004.1421285
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-10-31
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Connectors Packaging Contact resistance Resists Lithography Pins Sockets Scanning probe microscopy Design methodology Gold
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Elevated temperature tensile/creep test of UV-LIGA nickel thin film for design of high-density micro connector

High density area array module connector

Micro connector fabricated by micro process technology

Miniature multi-contact ZIF connector design using leverage from internal flexible fine metal pins

Development of 3-Dimentional Micro Probe using X-Ray Lithography and High-Strength Electroformed Ni

In-situ control of quantum point contacts using scanning probe microscopy scratch lithography

Multichip module connector evaluation at Unisys

Deflection analysis of spring connector

Conductive Polymer Patternd Media for Scanning Multiprobe Data Storage

Characteristics of Ni electroformed micro connector used for high density packaging

Similar Documents

Elevated temperature tensile/creep test of UV-LIGA nickel thin film for design of high-density micro connector

High density area array module connector

Micro connector fabricated by micro process technology

Miniature multi-contact ZIF connector design using leverage from internal flexible fine metal pins

Development of 3-Dimentional Micro Probe using X-Ray Lithography and High-Strength Electroformed Ni

In-situ control of quantum point contacts using scanning probe microscopy scratch lithography

Multichip module connector evaluation at Unisys

Deflection analysis of spring connector

Conductive Polymer Patternd Media for Scanning Multiprobe Data Storage

Characteristics of Ni electroformed micro connector used for high density packaging