NDLI: Automatic fabrication system for plastic microfluidic chips

Content Provider	IEEE Xplore Digital Library
Author	Wang Xiaodong Wang Liding Liu Chong Ma Liqun Luo Yi
Copyright Year	2004
Description	Author affiliation: Res. Center for Micro Syst. Technol., Dalian Univ. of Technol., China (Wang Xiaodong; Wang Liding; Liu Chong; Ma Liqun; Luo Yi)
Abstract	An automatic fabrication system for batch production of plastic microfluidic chips was developed. The fabricated chips can be used for capillary electrophoresis analysis. The processing technique of chip fabrication mainly includes three steps: microchannel fabrication using hot-embossing technique, precise alignment of the chip's substrate and cover, thermal bonding of the substrate and the cover. Hot-embossing machine, automatic aligning equipment for transparent substrates and thermal bonding machine were developed according to the processing technique. The automatic fabrication system and its constitutional equipments, the embedded processing techniques and auxiliary functions are described and explained in the paper. The auxiliary functions, such as automatic de-embossing and pre-joining of the plastic substrate and cover, are realized for fully automatic fabrication.
Starting Page	331
Ending Page	336
File Size	1871828
Page Count	6
File Format	PDF
ISBN	0780386078
DOI	10.1109/MHS.2004.1421270
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-10-31
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fabrication Plastics Microfluidics Substrates Bonding Chemical analysis Glass Costs Chip scale packaging Semiconductor materials
Content Type	Text
Resource Type	Article

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