NDLI: Power supply wires self-heating analysis

Content Provider	IEEE Xplore Digital Library
Author	Casu, M. Graziano, M. Roch, M.R. Viglione, F.
Copyright Year	2001
Description	Author affiliation: VLSI Lab., Politecnico di Torino, Italy (Casu, M.; Graziano, M.; Roch, M.R.; Viglione, F.)
Abstract	Self-heating is one of the major problems of high performance ICs due to scaled feature sizes, interconnect congestion and increased current densities. As a consequence, particular attention is necessary to avoid reliability drawbacks. In this paper we report analysis results achieved evaluating self-heating of power supply busses in presence of current injection related to different working conditions. This set of estimations has been realized considering three distinct metal layers and two logic families. This analysis and optimization methodology and results will be inserted in a developing tool for power supply noise evaluation and reduction, with the aim to take into account thermal phenomena while optimizing power bus sizing and routing for noise avoidance.
Sponsorship	IEEE
Starting Page	115
Ending Page	118
File Size	412700
Page Count	4
File Format	PDF
ISBN	078037522X
DOI	10.1109/ICM.2001.997501
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-10-29
Publisher Place	Morocco
Access Restriction	Subscribed
Rights Holder	ICM
Subject Keyword	Power supplies Wires Logic Frequency Current density Optimization methods Noise reduction Temperature Circuit simulation Very large scale integration
Content Type	Text
Resource Type	Article

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