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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Welch III, W.C. Khalil Najafi |
| Copyright Year | 2005 |
| Description | Author affiliation: Center for Wireless Integrated Microsyst. (WIMS), Michigan Univ., Ann Arbor, MI, USA (Welch, W.C., III; Khalil Najafi) |
| Abstract | This paper presents a modular, low profile, wafer-level encapsulation technology for 0-level MEMS packaging. Electroplated caps are formed on a carrier wafer then simultaneously transferred and bonded to a device wafer by a novel solder transfer method and transient liquid phase (TLP) bonding technology. The solder transfer method is enabled by the dewetting of the solder transfer layer from the carrier wafer, and TLP bonding of the cap to the device wafer during bonding. The nickel-tin TLP bond and transfer cycle has a maximum temperature of 300 /spl deg/C and lasts about 2.5 hours. This approach has been demonstrated with nickel caps 5 microns thick, ranging in size from 200 /spl mu/m 1 mm. They were transferred with a lead-tin transfer solder layer and bonded with nickel-tin TLP bonding with greater than 99% transfer yield across the wafer. |
| Starting Page | 584 |
| Ending Page | 587 |
| File Size | 757105 |
| Page Count | 4 |
| File Format | |
| ISBN | 0780387325 |
| ISSN | 10846999 |
| DOI | 10.1109/MEMSYS.2005.1453997 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2005-01-30 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Micromechanical devices Wafer scale integration Packaging Wafer bonding Transistors Protection Hermetic seals Costs Thin film devices Polymer films |
| Content Type | Text |
| Resource Type | Article |
| Subject | Condensed Matter Physics Electronic, Optical and Magnetic Materials Mechanical Engineering Electrical and Electronic Engineering |
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