NDLI: Modeling of capillary forces and binding sites for fluidic self-assembly

Content Provider	IEEE Xplore Digital Library
Author	Bohringer, K.F. Srinivasan, U. Howe, R.T.
Copyright Year	2001
Description	Author affiliation: Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA (Bohringer, K.F.)
Abstract	Massively parallel self-assembly is emerging as an efficient, low-cost alternative to conventional pick-and-place assembly of microfabricated components. The fluidic self-assembly technique we have developed exploits hydrophobic-hydrophilic surface patterning and capillary forces of an adhesive liquid between binding sites to drive the assembly process. To achieve high alignment yield, the desired assembly configuration must be a (global) energy minimum, while other (local) energy minima corresponding to undesired configurations should be avoided. Thus, the design of an effective fluidic self-assembly system using this technique requires an understanding of the interfacial phenomena involved in capillary forces; improvement of its performance involves the global optimization of design parameters such as binding site shapes and surface chemistry. This paper presents a model and computational tools for the efficient analysis and simulation of fluidic self-assembly. The strong, close range attractive forces that govern our fluidic self-assembly technique are approximated by a purely geometric model, which allows the application of efficient algorithms to predict system behavior. Various binding site designs are analyzed, and the results are compared with experimental observations. For a given binding site design, the model predicts the outcome of the self assembly process by determining minimum energy configurations and detecting unwanted local minima, thus estimating expected yield. These results can be employed toward the design of more efficient self-assembly systems.
Sponsorship	IEEE Robotics & Autom Soc
Starting Page	369
Ending Page	374
File Size	659287
Page Count	6
File Format	PDF
ISBN	0780359984
ISSN	10846999
DOI	10.1109/MEMSYS.2001.906555
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-01-25
Publisher Place	Switzerland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Self-assembly Assembly Computational modeling Predictive models Design optimization Shape Chemistry Analytical models Solid modeling Prediction algorithms
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Mechanical Engineering Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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