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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Okabe, T. Akaiwa, M. Shirakawa, T. Yokouchi, T. Sugimoto, T. |
| Copyright Year | 1993 |
| Description | Author affiliation: Production Eng. Res. Lab., Hitachi Ltd., Yokohama, Japan (Okabe, T.; Akaiwa, M.; Shirakawa, T.; Yokouchi, T.) |
| Abstract | The authors have developed a system for the final visual inspection of LSI packages. The automation of the final visual inspection lags behind that for other processes in LSI assembly. To reduce costs and standardize inspection criteria, technology for this automation should be developed as soon as possible. To automate the final visual inspection, one must solve several problems. As packages are becoming larger and lead pitches finer the authors have developed an image input method that satisfies those divergent conditions. The authors have also built hardware that is capable of high-speed processing to inspect the large number of items required in final inspection, and developed software to check for defects precisely and reliably. |
| Starting Page | 1877 |
| Ending Page | 1881 |
| File Size | 331862 |
| Page Count | 5 |
| File Format | |
| ISBN | 0780308913 |
| DOI | 10.1109/IECON.1993.339360 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1993-11-15 |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Inspection Large scale integration Assembly Surface cracks Humans Semiconductor device packaging Automation Costs Hardware Electronics packaging |
| Content Type | Text |
| Resource Type | Article |
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