NDLI: The TPX superconducting magnet fabrication process

Content Provider	IEEE Xplore Digital Library
Author	Citrolo, J.C. Chrzanowski, J. Schultz, J.
Copyright Year	1993
Description	Author affiliation: Plasma Phys. Lab., Princeton Univ., NJ, USA (Citrolo, J.C.; Chrzanowski, J.)
Abstract	The TPX Toroidal Field (TF) and Poloidal Field (PF) Coils use both Nb/sub 3/Sn and Nb-Ti internally cooled, cabled superconductor (ICCS). A prime consideration in the design of the coils was the minimization of joints in the conductor cable to save space, reduce heating losses sand increase reliability. Therefore, the traditional double pancake approach was discarded in favor of the continuously wound coil. The recently developed use of the roll bender in winding the coils permits the backwinding, which is required in this geometry. The Nb/sub 3/Sn TF coils, the central solenoid coils and inner-most PF coils require the wind-react-insulate sequence. The Nb-Ti outer PF Coils are also insulated after the coils are wound because the insulation system used in all the coils requires the insulation of rigid polyimide sheet between turns and pancakes before Vacuum Pressure Impregnation (VPI) of the glass epoxy system. This paper proposes and discusses a manufacturing plan based upon the use of the roll bender in the winding of the coil, and a special fixture to spread apart the turns of the coil and permit the application of the insulation materials prior to VPI.
Starting Page	798
Ending Page	801
File Size	398094
Page Count	4
File Format	PDF
ISBN	0780314123
DOI	10.1109/FUSION.1993.518446
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1993-10-11
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Superconducting magnets Fabrication Superconducting coils Insulation Superconducting cables Niobium Tin Space heating Wounds Conductors
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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