NDLI: Applying kirigami models in teaching micro-electro-mechanical systems

Content Provider	IEEE Xplore Digital Library
Author	Liang, Y.C.
Copyright Year	2013
Description	Author affiliation: Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore (Liang, Y.C.)
Abstract	Kirigami is a Japanese art-form by making cuts on paper together with geometric folding to form three-dimensional structures. This technique enables one to create visual presentation of an object in good and simple analogy. For the first time, the paper model of kirigami was applied in the classroom teaching of silicon MEMS (micro-electro-mechanical systems) course. These MEMS structures are in reality made by complicated and high-cost silicon wafer fabrication processes named silicon micromachining, which consists the lithography, thin-film deposition and etching processes. In the class teaching, the precisely scaled analogy of silicon micro-mechanical structures is created using paper material to form the appropriate kirigami paper models. By applying the physics of scaling rules for different material properties, such as Young's modulus, density and strain limit, the properties of micro-mechanical structures supposedly made by silicon micromachining processes can be experimentally validated by the kirigami paper models. This innovative teaching methodology achieves an effective learning outcome for students to quickly understand the micro-mechanical system interaction by real observation, but without using any complicated finite-element computer simulation tools or going through high-cost silicon wafer fabrication processes.
Sponsorship	IEEE Educ. Soc.
Starting Page	83
Ending Page	86
File Size	741411
Page Count	4
File Format	PDF
ISBN	9781467351133
e-ISBN	9781467351126
DOI	10.1109/IEDEC.2013.6526765
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-03-04
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micromechanical devices Radio frequency Paper Model Young's modulus Education Resonant frequency Micromachining Silicon MEMS Springs Silicon Microsystem
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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