NDLI: Towards improving the etch performance of KrF excimer laser micromachining on silicon material

Content Provider	IEEE Xplore Digital Library
Author	Zainol, M.Z. Johari, S. Fazmir, H. Anuar, A.F.M. Wahab, Y. Mazalan, M.
Copyright Year	2015
Description	Author affiliation: Adv. Multi-Diciplinary MEMS-Based Integrated NCER Centre of Excellent, Univ. Malaysia Perlis, Arau, Malaysia (Zainol, M.Z.; Johari, S.; Fazmir, H.; Anuar, A.F.M.; Wahab, Y.; Mazalan, M.)
Abstract	Excimer laser micromachining enables us to overcome the conventional lithography-based microfabrication limitations and simplify the process of creating three dimensional (3D) microstructures. The objective of these study are to investigate the relation between frequency (f), number of laser pulse (P), fluence (F) and their etch performance. This paper presents a parametric characterization study on silicon using KrF excimer laser micromachining. From the result, the etch rate change were recorded as the three major laser parameters (frequency, number of pulse and fluence) were varied. From the results, we found that the fluence has the highest influence on silicon etching rate due to factors of photothermal and photochemical, while frequency and the number of laser pulses do not change the energy.
Starting Page	1
Ending Page	4
File Size	474945
Page Count	4
File Format	PDF
e-ISBN	9781479985500
DOI	10.1109/RSM.2015.7354953
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-08-19
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micromachining Silicon Etching Surface roughness Rough surfaces Laser beams Krypton fluoride Excimer laser KrF
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Etch Performance of KRF Excimer Laser Micromachining Characterization on Silicon Material

Pulsed Laser Assisted Chemical Etch for analytic surface preparation

Silicon Waveguide Sidewall Smoothing by KrF Excimer Laser Reformation

TMAHW etchants for silicon micromachining

Temporal evolution of silicon surface roughness during anisotropic etching processes

Rapid formation of deeply doped layer in crystalline silicon using KrF excimer laser-driven diffusion

Sidewall roughness control in deep reactive ion etch process for micromachined Si devices

The effect of release-etch processing on surface microstructure stiction

Fabrication of sub-micrometer Si spheres with atomic-scale surface smoothness using homogenized KrF excimer laser reformation system

Towards improving the etch performance of KrF excimer laser micromachining on silicon material

Similar Documents

Etch Performance of KRF Excimer Laser Micromachining Characterization on Silicon Material

Pulsed Laser Assisted Chemical Etch for analytic surface preparation

Silicon Waveguide Sidewall Smoothing by KrF Excimer Laser Reformation

TMAHW etchants for silicon micromachining

Temporal evolution of silicon surface roughness during anisotropic etching processes

Rapid formation of deeply doped layer in crystalline silicon using KrF excimer laser-driven diffusion

Sidewall roughness control in deep reactive ion etch process for micromachined Si devices

The effect of release-etch processing on surface microstructure stiction

Fabrication of sub-micrometer Si spheres with atomic-scale surface smoothness using homogenized KrF excimer laser reformation system

Towards improving the etch performance of KrF excimer laser micromachining on silicon material