NDLI: A novel hybrid intelligence approach for 2D packing through internet crowdsourcing

Content Provider	IEEE Xplore Digital Library
Author	Agrawal, A. Yadav, P. Upadhyay, C.K. Corney, J.R. Annamalai Vasantha, G.V. Jagadeesan, A.P. Lynn, A.
Copyright Year	2015
Description	Author affiliation: Dept. of Inf. Technol., Indian Inst. of Inf. Technol. Allahabad, Allahabad, India (Agrawal, A.; Yadav, P.; Upadhyay, C.K.) \|\| Design Manuf. & Eng. Manage., Univ. of Strathclyde, Glasgow, UK (Corney, J.R.; Annamalai Vasantha, G.V.; Jagadeesan, A.P.; Lynn, A.)
Abstract	Packing problems on its current state are being utilized for wide area of industrial applications. The aim of present research is to create and implement an intelligent system that tackles the problem of 2D packing of objects inside a 2D container, such that objects do not overlap and the container area is to be maximized. The packing problem becomes easier, when regular/rectangular objects and container are used. In most of the practical situations, the usage of irregular objects comes to existence. To solve the packing problem of irregular objects inside a rectangular container, a hybrid intelligence approach is introduced in our proposed work. The combination of machine intelligence and human intelligence is referred as the hybrid intelligence or semi-automated approach in the proposed methodology. The incorporation of human intelligence in the outcome of machine intelligence is possible to obtain using the internet crowdsourcing as we wish to handle the packing problem through internet crowdsourcing involving rural people. The proposed methodology is tested on different standard data sets and it is observed that it has clear advantage over both manual as well as fully automated heuristic based methods in terms of time and space efficiency.
Starting Page	33
Ending Page	39
File Size	1278801
Page Count	7
File Format	PDF
e-ISBN	9781479977581
DOI	10.1109/TIAR.2015.7358527
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-07-10
Publisher Place	India
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Crowdsourcing Greedy algorithms Shape Hybrid Intelligence approach Manuals Containers 2D packing Machine intelligence
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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