NDLI: Simulation and optimization on thermal performance of LED filament light bulb

Content Provider	IEEE Xplore Digital Library
Author	Feng, W. Feng, B. Zhao, F. Shieh, B. Lee, R.
Copyright Year	2015
Description	Author affiliation: HKUST LED-FPD Technol. R&D Center at Foshan, Foshan, China (Feng, W.; Feng, B.; Zhao, F.; Shieh, B.; Lee, R.)
Abstract	In the present study, a computational model of LED filament light bulb was established by the ANSYS Icepak software based on the finite element method (FEM) and was compared with the experimental data as well. With the developed model, the effects of the filling gas and the filament substrate on the steady-state thermal performance were investigated. The simulation results revealed that the thermal conductivity of the filling gas in the bulb had a significant influence on the heat dissipation of the bulb. Compared with air filling, helium can reduce the average junction temperature of LED chips bonded on the sapphire substrate by 54.6 °C. With a glass filament substrate and helium filling in the bulb as the base case, the average junction temperature reductions of LED chips bonded on transparent ceramics, sapphire and perforated copper were 9.6 °C, 11.4 °C, and 22.4 °C, respectively. It was found that the higher the thermal conductivity of the filling gas, the less junction temperature change would be resulted from different filament substrates. In conclusion, this model can benefit the optimization of thermal design for a LED filament light bulb.
Starting Page	88
Ending Page	92
File Size	647772
Page Count	5
File Format	PDF
ISBN	9781509001750
e-ISBN	9781509001767
DOI	10.1109/SSLCHINA.2015.7360696
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-11-02
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Substrate Simulation Conductivity Light emitting diodes Thermal conductivity Filament bulb Filling LED Helium Junctions Substrates Thermal
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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