NDLI: Reliability investigations on stacked chip on MEMS

Content Provider	IEEE Xplore Digital Library
Author	Kaulfersch, E. Winkler, T. Bramer, B. Hammacher, J.
Copyright Year	2011
Description	Author affiliation: Branch Lab Chemnitz, Berliner Nanotest und Design GmmbH, Germany (Kaulfersch, E.; Winkler, T.) \|\| MMC Chemnitz, Fraunhofer ENAS, Germany (Bramer, B.; Hammacher, J.)
Abstract	Increasing functionality in vehicles especially with respect to electromobility is demanding a decrease of energy consumption of numerous board systems. Clustering and miniaturization of sensor applications on the one hand are enabling new features and on the other they are minimizing energy needs for their operation. For modern vehicle driving stability or navigation systems e.g., the SCoM (stacked chip on MEMS) approach will provide the technology enabling shrinking of the sensors size on a high integration level by bringing intelligence directly to the sensor. To cope with the reliability requirements, restrictive qualification and zero defect strategies have been established by the automotive industry. Hence, introduction of innovative technologies in automotive applications must be accompanied by the demonstration of their reliability and safety. It is the goal of the RESTLES [1] project to eliminate parasitic sensor effects caused by process tolerances, intrinsic material stress, thermal mismatch, temperature and aging phenomena by transferring dedicated compensation models into the sensor and circuit design. To evaluate influences of thermo-mechanical stresses and strains, extensive simulations of the package behavior and non-destructive evaluation have been performed.
Starting Page	1
Ending Page	4
File Size	3013205
Page Count	4
File Format	PDF
ISBN	9781457704314
e-ISBN	9781457704307
DOI	10.1109/SCD.2011.6068761
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-09-27
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micromechanical devices Nondestructive evaluation Cooling Creep 3D-integration Reliability Flip chip Virtual prototyping Stress Strain MEMS sensor
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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