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Content Provider | IEEE Xplore Digital Library |
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Author | Pantazica, M. Marghescu, C. Svasta, P. Varzaru, G. Plotog, I. Tamas, C.A. |
Copyright Year | 2012 |
Description | Author affiliation: Center for Technological Electronics and Interconnection, Techniques, “Politehnica” University of Bucharest (UPB-CETTI), Bucharest, Romania (Pantazica, M.; Marghescu, C.; Svasta, P.; Varzaru, G.; Plotog, I.) || Application Design Department, O2Micro, Bucharest, Romania (Tamas, C.A.) |
Abstract | The paper shows the results of a second approach of the Surface Insulation Resistance (SIR) test performed in order to test the quality of solder pastes. The aim of the SIR test was to establish the influence of the reflow method used and of a protective coating on the SIR. At the end of this test, a comparison between the obtained results was done. Both tests were done in the conditions of environment heat and high humidity. The boards used in both experiments are special designed test pattern boards (IPC-B-24) and the no-clean solder pastes are the following: SAC305, SN100C, SN100C-XF3 OM338PT, OM5300 [1]. The measurements of the SIR values showed better results keeping in mind that this was the second experiment and that we gained experience during the first experiment. |
Starting Page | 151 |
Ending Page | 156 |
File Size | 979022 |
Page Count | 6 |
File Format | |
ISBN | 9781467347570 |
e-ISBN | 9781467347600 |
DOI | 10.1109/SIITME.2012.6384366 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2012-10-25 |
Publisher Place | Romania |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Resistance Insulation Voltage measurement Inspection No-clean fluxes VPS IR/convection Coatings Copper SIR Solder paste |
Content Type | Text |
Resource Type | Article |
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