NDLI: Charge decay enhancement in polymer powders using plasma treatment

Content Provider	IEEE Xplore Digital Library
Author	Sharma, R. Sims, R.A. Mazumder, M.K.
Copyright Year	2002
Description	Author affiliation: Dept. of Appl. Sci., Arkansas Univ., Little Rock, AR, USA (Sharma, R.; Sims, R.A.; Mazumder, M.K.)
Abstract	Slow charge decay characteristics of polymer powders results in occurrence of back corona which adversely affects the integrity of the powder film. The surface property that primarily governs the charge decay characteristics and back corona is the surface resistivity of the powder layer. Since the charge decay through these highly resistive polymers is primarily a surface phenomenon, surface modification was used to modify charge decay characteristics of acrylic and epoxy polymer powders. A fluidized bed type plasma reactor was built for surface modification of polymer powders. A 12 kV power supply at 700 Hz was used to generate plasma between copper electrodes in the reactor using argon as feed gas. The charge decay characteristics of untreated and plasma treated acrylic polymer powder samples were measured at different relative humidities varying form 20% to 70%. The charge decay time constant for plasma treated powder was 458 minutes at 18%RH whereas for untreated powder it was 996 minutes. These values became 11 minutes for plasma treated powder and 20 minutes for untreated powder at 65% RH. To study the effect of plasma treatment time on charge decay enhancement, an epoxy powder was plasma treated for 1,2,4 and 10 minutes and charge decay time constants measured. Treatment times of 1,2 and 4 minutes increased the charge decay properties, but there was no further improvement over 4 minute exposure time.
Starting Page	610
Ending Page	613
File Size	301210
Page Count	4
File Format	PDF
ISBN	0780374207
ISSN	01972618
DOI	10.1109/IAS.2002.1044152
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-10-13
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Plasma properties Powders Current measurement Conductivity Plasma measurements Polymer films Corona Inductors Surface treatment Charge measurement
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Electrical and Electronic Engineering

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Effect of ambient relative humidity on charge decay properties of polymer powder and on the occurrence of back corona in powder coating

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Charge behavior observation on/in plasma processed thin films by LIPP during thermal heating for TSDC analysis

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