NDLI: Thermal characterization of DBC and MMC stacks for power modules

Content Provider	IEEE Xplore Digital Library
Author	Fusaro, J.M. Romero, G.L. Rodriguez, P. Martinez Jr., J.L.
Copyright Year	1996
Description	Author affiliation: Hybrid Power Modules Oper., Motorola Inc., Phoenix, AZ, USA (Fusaro, J.M.)
Abstract	This paper presents the predicted thermal characterization of silicon carbide aluminum (SiC/Al) baseplates under high current applications. SiC/Al, or metal matrix composites (MMC) is a technology being evaluated for application in high current power modules. In an effort to improve module reliability, the Hybrid Power Module operation (HPM) chose to investigate the possibility of tailoring a material, such that the structural characteristics of a baseplate would match that of a ceramic isolation without compromising thermal performance. The result was SiC/Al MMC which are constructed by infiltrating a molten aluminum alloy into a molded or machined porous silicon carbide preform, such as a baseplate. Through controlling the volumetric fraction of the aluminum alloy during infiltration, various thermal-structural properties can be tailored to achieve desired values. The end result is a composite structure with superior structural properties than copper, however with thermal properties which warrant further investigation, hence the subject of this paper. Thermal characterization of SiC/Al (or MMC) began with defining various module configurations, whereby a direct comparison of copper baseplate technologies could be ascertained. To assist in expediting the design process for analytical and experimental evaluation a series of solid models were constructed which were then utilized for subsequent finite element analyses and the production of test specimens. This paper discusses the various methodologies employed for the development of MMC baseplate technology and the analytical and experimental simulation results.
Starting Page	1411
Ending Page	1417
File Size	565839
Page Count	7
File Format	PDF
ISBN	0780335449
ISSN	01972618
DOI	10.1109/IAS.1996.559250
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-10-06
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Process design Silicon carbide Preforms Multichip modules Materials reliability Isolation technology Aluminum alloys Solids Ceramics Copper
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Electrical and Electronic Engineering

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