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| Content Provider | IEEE Xplore Digital Library | 
|---|---|
| Author | Browning, D.W. Distefano, E. | 
| Copyright Year | 2010 | 
| Description | Author affiliation: PC Client Group, Intel Corporation, Santa Clara, CA (Browning, D.W.; Distefano, E.) | 
| Abstract | Mobile Original Equipment Manufacturers (OEMs) place great emphasis on creating unique system designs to differentiate themselves in the mobile market. Intel Corporation's introduction of low-power, high-performance Intel® processors based on original 45 nm Intel Core™ microarchitecture, originally referred to by the codename Penryn, brings a new level of opportunity for differentiation into the mainstream segment without sacrificing performance. The Mobile Penryn family of processors offers mainstream performance at 25 watts (W) Thermal Design Power (TDP), 10 W less than previous generation processors. In this paper we discuss the fundamentals of system cooling capabilities in any given form factor and look at how power relates to the thinner, cooler, and quieter systems. | 
| Starting Page | 1 | 
| Ending Page | 5 | 
| File Size | 626762 | 
| Page Count | 5 | 
| File Format | |
| ISBN | 9781424482733 | 
| e-ISBN | 9781424482757 | 
| DOI | 10.1109/ICEAC.2010.5702305 | 
| Language | English | 
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) | 
| Publisher Date | 2010-12-16 | 
| Publisher Place | Egypt | 
| Access Restriction | Subscribed | 
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) | 
| Subject Keyword | Program processors Cooling Atmospheric modeling Mobile communication Skin System analysis and design Noise level | 
| Content Type | Text | 
| Resource Type | Article | 
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