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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Qing Bai Wise, K.D. |
| Copyright Year | 1998 |
| Description | Author affiliation: Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI, USA (Qing Bai) |
| Abstract | An improved fabrication process has been developed for neural probes containing on-chip signal processing circuitry, and several types of active recording amplifiers/buffers have been explored for single-unit recording in-vivo. The first three-dimensional (3D) active probe array has also been created using this process and 3D microassembly techniques. Recording experiments with buffered (active) electrode sites and adjacent unbuffered (passive) sites have clearly shown that the on-chip electronics does not degrade the noise performance of 3-4 M/spl Omega/ recording channels. Test results also indicate that stabilization of the random DC drift associated with the electrochemical metal-electrolyte interface is critically important in connection with the use of high-gain on-chip preamplifiers. |
| Starting Page | 1826 |
| Ending Page | 1829 |
| File Size | 927943 |
| Page Count | 4 |
| File Format | |
| ISBN | 0780351649 |
| ISSN | 1094687X |
| DOI | 10.1109/IEMBS.1998.746946 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1998-11-01 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Microelectrodes Probes Fabrication Array signal processing Circuits Microassembly Electrodes Degradation Active noise reduction Testing |
| Content Type | Text |
| Resource Type | Article |
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