NDLI: Experiments and analyses of flat miniature heat pipes

Content Provider	IEEE Xplore Digital Library
Author	Cao, Y. Gao, M. Beam, J.E. Donovan, B.
Copyright Year	1996
Description	Author affiliation: Dept. of Mech. Eng., Florida Int. Univ., Miami, FL, USA (Cao, Y.)
Abstract	Two flat copper-water axially-grooved miniature heat pipes are fabricated employing the electric-discharge-machining (EDM) wire-cutting method. Due to the advantage of the EDM method, axial grooves are provided around the entire interior perimeters of the miniature heat pipes. The two miniature heat pipes are tested under different heat inputs, cooling temperatures, and orientations. The maximum heat transfer rate for the heat pipes tested is about 40 W, and the maximum heat flux achieved is about 20 W/cm/sup 2/ The effective thermal conductance of the heat pipe is on the order of 40 times that of copper based on the external cross-sectional area of the miniature heat pipe. If the effective thermal conductance is evaluated based on the interior cross-sectional area of the heat pipe, it can be 100 times higher than the thermal conductivity of copper. Analyses for heat pipe limitations are also performed based on some analytical relations. It is found that the capillary limit is the dominant heat transfer limitation for the miniature heat pipes tested in this paper. To improve the accuracy of the analytical model, the hydraulic radius in the capillary limit is corrected using the exact two-dimensional solutions found in the literature, and the expression for the friction factor that takes into account the shear stress at the liquid/vapor interface is adopted. The analytical results based on these modifications are compared with corresponding experimental results with good agreement.
Starting Page	1402
Ending Page	1409
File Size	676381
Page Count	8
File Format	PDF
ISBN	0780335473
ISSN	10893547
DOI	10.1109/IECEC.1996.553927
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-08-11
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heat transfer Thermal conductivity Testing Copper Performance analysis Resistance heating Cooling Temperature Analytical models Friction
Content Type	Text
Resource Type	Article

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