NDLI: Long-term behavior of IMCs in lead-free solder joints

Content Provider	IEEE Xplore Digital Library
Author	Novak, T. Hujer, T. Steiner, F.
Copyright Year	2011
Description	Author affiliation: Department of Technologies and Measurement, Faculty of Electrical Engineering, University of West bohemia in Pilsen, Czech Republic (Novak, T.; Hujer, T.; Steiner, F.)
Abstract	This article deals with the creation and growth of intermetallic compounds (IMCs) in solder joints. The test specimens of copper substrate were made for this experiment. The soldered joints were created on the test specimens by hand soldering process at the temperature of 250°C. Four lead-free solder alloys and one tin-lead solder alloy were chosen for research of IMCs. The test specimens were divided into several groups. These groups differ in two parameters. The first parameter is soldering process, concretely soldering time. Half of the specimens were soldered for a period of 10 seconds and the second half of specimens were soldered for a period of 60 seconds. The second parameter is a thermal stress. The test specimens were exposed to elevated aging for research of long-term behavior of IMCs in solder joint. The specimens were thermal stressed in hot air oven at the temperature of 150°C for a periods of 4, 8, 12, 16 and 20 weeks. The results of analysis of IMCs in solder joints using confocal and metallographic microscopes are presented in this article.
Starting Page	176
Ending Page	181
File Size	822063
Page Count	6
File Format	PDF
ISBN	9781457721113
ISSN	21612536
e-ISBN	9781457721120
DOI	10.1109/ISSE.2011.6053573
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-05-11
Publisher Place	Slovakia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Aging Substrates Thickness measurement Copper Lead
Content Type	Text
Resource Type	Article

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