NDLI: Ecological technologies for soldering without lead in electronic and telecommunications

Content Provider	IEEE Xplore Digital Library
Author	Mihaescu, R. Carstea, H.
Copyright Year	2003
Description	Author affiliation: Dept. of Operations, ALCATEL NS, Timisoara, Romania (Mihaescu, R.)
Abstract	In context of todays technological development, the European Union has elaborated an order regarding the development of the electrical and electronical equipment, banning the use lead in special soldering alloys from electronic and electrotechnical fields, starting with 2006. In order to minimize the environmental risks, the recycling law forced the manufacturers of the electrical and electronical equipments to recover and recycle the out of service devices. Based on didactical experience and on authors research, this work paper presents a synthesis of the most recent studies from famous companies, regarding the development of new materials and technologies, which can successfully replace with minimum costs the traditional technology based on tin-lead (Sn-Pb) soldering. This work paper analyzes the logistics, availability and reliability of the most suitable substitutes for the alloy based on lead, and the techniques for recycling-reusing-revaluation of the-new ecological alloys and also the costs involved by these new technologies.
Starting Page	232
Ending Page	234
File Size	219642
Page Count	3
File Format	PDF
ISBN	0780380029
DOI	10.1109/ISSE.2003.1260522
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-05-08
Publisher Place	Slovakia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Lead Paper technology Copper alloys Tin alloys Temperature Zinc Chemical technology Costs Bismuth
Content Type	Text
Resource Type	Article

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Trends and challenges in lead free soldering

Interface phenomena in lead-free soldering

Alternatives of lead bearing solder alloys

Reflow soldering evaluation of lead free solder alloys

Development of thermodynamic database for micro-soldering alloys

Flux technology for lead-free alloys and its impact on cleaning

Incompatibility Problems in Soldering Technology

Thermal Properties of Tin/Silver Alloy Nanoparticles for Low Temperature Lead-free Interconnect Technology

Study on the interfaces between copper alloys for lead frame and Sn-Pb solder alloys

Ecological technologies for soldering without lead in electronic and telecommunications - today and tomorrow

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Development of thermodynamic database for micro-soldering alloys

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