NDLI: Assessing product design alternatives with respect to environmental performance and sustainability: a case study for circuit pack faceplates

Content Provider	IEEE Xplore Digital Library
Author	Mosovsky, J. Dispenza, J. Dickinson, D. Morabito, J. Caudill, R. Alli, N.
Copyright Year	2001
Abstract	Environmental lifecycle assessment (LCA) must be integrated into design systems to achieve continuous improvement in the environmental performance of products. This provides the designer feedback on the lifecycle environmental impacts of an evolving design, emphasizing material, process or form substitution to decrease environmental impact. The New Jersey Institute of Technology (NJIT) has developed a prototype design for environment (DFE) and environmental LCA software tool that interfaces with Pro/Engineer (CAD tool) to extract product description and bill of materials data in order to conduct an environmental LCA inventory analysis. The inventory analysis is modeled to account for materials flows, energy usage, and environmental burdens, as well as costs associated with the product life cycle. Environmental impact assessment of the inventory analysis and interpretation of the results are performed with EcoPro, a universal lifecycle metric developed at Lucent Technologies that can provide the designer quantified feedback on environmental performance and sustainability in the form of single indicators for resource productivity (RP) and eco-efficiency (EE). Two different circuit pack faceplate designs were evaluated. Pro/Engineer files representing a proposed "two-shot" molded thermoplastic faceplate and a current metal (aluminum) assembly design were evaluated using the NJIT software tool and EcoPro. Results for RP and EE of the two designs and comparison of cost data demonstrate the benefits of the proposed design as well as the advantages of using this approach to evaluate alternative designs, construction, processes and materials.
Sponsorship	IEEE Comput. Soc., Tech. Committe on Electron. & the Environ
Starting Page	252
Ending Page	257
File Size	532466
Page Count	6
File Format	PDF
ISBN	0780366557
ISSN	10952020
DOI	10.1109/ISEE.2001.924535
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-09
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Product design Feedback Process design Conducting materials Software tools Design engineering Costs Continuous improvement Software prototyping Data engineering
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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