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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hu, B. Cai, C. Dongji Xie Boyi Wu |
| Copyright Year | 2010 |
| Description | Author affiliation: Flextronics, 1-2/F, Vision Shenzhen Business Park 9 Gaoxin 9th South Rd. Hi-tech Industrial Park, NanShan District, China 518057 (Hu, B.; Cai, C.; Dongji Xie; Boyi Wu) |
| Abstract | Measurement of failure strength of brittle material is always a challenge. Silicon die and LCD glass are two major brittle components in electronic products. Both of them may fail when subject to a large stress during manufacturing, assembling and in field. In order to assess the risk of failure, both 3-point bending (3PB) and ball-on-ring (BOR) are employed to measure the flexural strength of silicon die and glass in this paper. The samples are taken from actual consumer digital products. It is found that the results from two different testing methods are quite different, which include the values of strength and the failure modes. The failure mechanism and location are also studied using finite element analysis (FEA). Two different cracking modes come out of the test results for both silicon die and LCD glass. One is cracking into many small pieces and this is the main cracking mode. The other is cracking into two half. |
| Starting Page | 217 |
| Ending Page | 219 |
| File Size | 643709 |
| Page Count | 3 |
| File Format | |
| ISBN | 9781424481408 |
| e-ISBN | 9781424481422 |
| DOI | 10.1109/ICEPT.2010.5582440 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-08-16 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Silicon Glass Mathematical model Equations Stress ball on ring (BOR) strength silicon die LCD glass 3-point bending (3PB) |
| Content Type | Text |
| Resource Type | Article |
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