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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lehman-Lamer, G. Annas, S.E. |
| Copyright Year | 1990 |
| Description | Author affiliation: Textronix Inc., Beaverton, OR, USA (Lehman-Lamer, G.; Annas, S.E.) |
| Abstract | Multilayer polyimide (MLP) structures are discussed. Recently, a low-mechanical-stress, low-dielectric-constant polyimide material has become commercially available. It can be processed using standard integrated-circuit (IC)/hybrid technologies and equipment. The material is ideally suited for use in high-density multilayer interconnect structures. The processing of thick (18- mu m) polyimide layers with buried metal layers is described. Applications of single-layer and multilayer polyimide structures can be designed into existing packaging products as an enhancement or be used as an added packaging structure for high-performance devices.< |
| Starting Page | 236 |
| Ending Page | 239 |
| File Size | 443323 |
| Page Count | 4 |
| File Format | |
| DOI | 10.1109/IEMT9.1990.115012 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1989-02-12 |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Nonhomogeneous media Polyimides Substrates Electronics packaging Etching Temperature Ceramics Space technology Dielectric materials Hybrid integrated circuits |
| Content Type | Text |
| Resource Type | Article |
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