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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Shu, B. |
| Copyright Year | 1992 |
| Description | Author affiliation: VLSI Technology Inc., San Jose, CA, USA (Shu, B.) |
| Abstract | The continuous miniaturization of computers necessitates the use of new high pin count plastic packages such as TQFP (thin quad flat pack). These new package types, with 1.4-, 1.0-, or 0.8-mm plastic package body thickness, have very limited space for bond wire, specifically in the loop height dimension. This restriction imposes a challenge to the traditional wire bond technology, especially when long wire is needed for small die. The author reviews the constraints a thin plastic package imposes on wire bonding, and presents a statistical design of an experiment based on a response surface methodology to characterize wire loop profile control. Based on the regression equations generated, a mathematical model is established to guide the development of a predetermined loop profile suitable for thin plastic package assembly. The effects of major bonding parameters, such as wire length, kink-height, reverse loop, loop factor, bonding speeds, and wire tension, and their interactions on loop profile are analyzed.< |
| Starting Page | 890 |
| Ending Page | 898 |
| File Size | 742349 |
| Page Count | 9 |
| File Format | |
| ISBN | 0780301676 |
| DOI | 10.1109/ECTC.1992.204312 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1992-05-18 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Wire Bonding Plastic packaging Electronics packaging Semiconductor device packaging Response surface methodology Space technology Assembly Microcomputers Microassembly |
| Content Type | Text |
| Resource Type | Article |
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