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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hoh, P.D. Bates, A.J.S. Strijek, A. Costrini, G. Antreasyan, A. Scontras, S. Ferrario, J. Cahoon, E. Behfar-Rad, A. |
| Copyright Year | 1992 |
| Description | Author affiliation: IBM, Hopewell Junction, NY, USA (Hoh, P.D.) |
| Abstract | A number of packaging configurations were explored as possible candidates for use with quad 1300-nm laser arrays operating at aggregate multi-Gb data rates. The packaging arrangements considered were with InP/GaInAsP-based double heterostructure ridge lasers. Quad laser arrays on single chips were packaged both junction up and junction down. Packages included simple CMSH submounts in 9-mm headers and custom wired silicon carriers on multilayered high-speed packages. Electrical and thermal measurements confirmed that T0 can technology will not meet the requirements needed for multi-Gb/s data links. A package that would surpass the requirements would include optimized wire-bond lengths, wire-bond orientation, and sufficient heat-sinking for the laser array and its associated electronics. A packaging arrangement was investigated which included the optimized conditions mentioned above and a custom wired silicon submount. Electrical crosstalk noise was reduced to -37 dB. Thermal effects were reduced to a point where lasers were able to operate at over 110 degrees C. This package surpassed the thermal and electrical crosstalk noise requirements demanded for multi-Gb/s data communication links.< |
| Starting Page | 88 |
| Ending Page | 92 |
| File Size | 415641 |
| Page Count | 5 |
| File Format | |
| ISBN | 0780301676 |
| DOI | 10.1109/ECTC.1992.204189 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1992-05-18 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Optical arrays Electronic packaging thermal management Semiconductor laser arrays Silicon Laser noise Crosstalk Aggregates Indium phosphide Electric variables measurement Semiconductor device measurement |
| Content Type | Text |
| Resource Type | Article |
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