NDLI: Advances in power integrity techniques

Please wait, while we are loading the content...

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems

Advances in power integrity techniques

An alternate power distribution scheme with superior noise suppression characteristics than EBG

Modeling and measurement of noise aware clocking in power supply noise analysis

System-level chip/package co-design for multi-core processors implemented with power-gating technique

A study of split and common ground referencing schemes for a high speed bus

Variability analysis for high-speed designs

Polynomial chaos based variability analysis of power distribution networks using a 3D topology of multiconductor transmission lines

General decoupled method for statistical interconnect simulation via polynomial chaos

Stochastic LIM for transient simulation of circuits with uncertainties

High-speed channels and statistical analysis

Statistical simulation of high-speed links with transmitter and receiver nonlinearities

Statistical modeling of metastability in ADC-based serial I/O receivers

Statistical eye diagram prediction for a 8b10b-coded channel using pulse response

Advances in TSVs and 3D interconnects

Multi-TSV crosstalk compensation based on digital MIMO channel equalization

Through silicon via (TSV) noise coupling effects on RF LC-VCO in 3D IC

A novel noise mitigation deisgn for TSV-to-device coupling using power distribution network

RF packages and interconnects

A lumped element circuit model for monolithic transformers in silicon-based RFICs

Broadband integration using FR-4 to silicon CPW-to-CPW transition

On aperture coupling based advanced design of antenna-filter-antenna elements in 60GHz compact system

Advanced macromodeling and simulation for power/signal integrity

High order Envelope Following method for parallel simulation of Power Converter circuits

Sparse noise-compliant synthesis of scattering macromodels via resistance extraction

Blackbox macro-modeling of the nonlinearity based on Volterra series representation of X-parameters

Optimal passivity enforcement of state-space models via localization methods

Artificial neural network modeling for Extrinsic capacitance of FinFET

Application of artificial neural networks for eye-height/width prediction from s-parameters

Application of nature inspired algorithms in power delivery network design: An industrial case study

Measurement trends for high-speed applications

IO power delivery network impedance measurement at chip level

Full-wave modeling of RF front end for successful design of DDR4 interposer for probing purposes

High-speed probe card design to reduce the crosstalk noise for wafer-level test

Impact of geometry of embedded pattern layer on signal integrity of coupled microstrips

Signal propogation in 3D interconnect

Design and early validation (using FPGA) of temperature resilient clock distribution networks for 3D ICs

A 0.65 mW/Gbps 30 Gbps capacitive coupled 10 mm serial link in 2.5D silicon interposer

A low-loss millimeter wave passive frequency band splitting technique

A scalable wideband equivalent circuit model for on-chip microstrips up to 110 GHz

High performance domain decomposition methods for signal integrity modeling in 3-D interconnects

Fast convergence of MoM-based package-board extraction via incremental eigen-AGMRES method

Hybrid modeling method for multilayered power/ground planes by Delaunay triangulation

Plane-pair PEEC models for PDN using sub-meshing

Advances in high-speed channel characterization

Discrete-time modeling and simulation considerations for high-speed serial links

USB3.1 transmitter compliance specification definition methodology

Jitter correlation induced by channel dispersion

Modeling and analysis of supply noise timing impact in a DDR4 interface system

Substrate noise coupling isolation using P+ contact array and grid ground plane in RF/mixed-signal 3D TSV ICs

PCB layer reduction to save system BOM cost in an Intel Haswell-EP server platform

Minimizing differential crosstalk of vias for high-speed data transmission

Method of moments based on isogeometric analysis for electrostatic field simulations of curved multiconductor transmission lines

Analysis of novel technology for power and signal integrity using a metal particle conductive layer

Accuracy tolerance analysis of the multimode TRL de-embedding technique

Power delivery solutions in 3-D processor-DRAM systems in presence of hot spots

EMI reduction by suppressing Q factor of total PDN with variable on-die capacitance and resistance

Crosstalk included eye diagram estimation of high-speed and wide I/O interposer channel for 2.5D / 3D IC

Determination of complex permittivity for low- and high-loss materials at microwave frequencies

Analysis of Wireless Power Transfer system design on active silicon interposer for low voltage applications in 3D-IC

Data pattern based electromagnetic interference modeling for IC packaging

Group velocity impacts on clock channel jitter amplification

Non-intrusive pseudo spectral approach for stochastic macromodeling of EM systems using deterministic full-wave solvers

Effectiveness analysis of de-embedding method for typical TSV pairs in a silicon interposer

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems

2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems

2008 IEEE-EPEP Electrical Performance of Electronic Packaging

2007 IEEE Electrical Performance of Electronic Packaging

2006 IEEE Electrical Performane of Electronic Packaging

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

Electrical Performance of Electronic Packaging - 2004

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)

Electrical Performance of Electronic Packaging,

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524)

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370)

Electrical Performance of Electronic Packaging

Proceedings of Electrical Performance of Electronic Packaging

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging

Proceedings of IEEE Electrical Performance of Electronic Packaging

[1992 Proceedings] Electrical Performance of Electronic Packaging

Central Library (ISO-9001:2015 Certified)
Indian Institute of Technology Kharagpur
Kharagpur, West Bengal, India | PIN - 721302

See location in the Map
03222 282435
Mail: support@ndl.gov.in

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in