NDLI: Embedded toroidal magnetic coupling probe in multi-layer PCBs for current measurement

Content Provider	IEEE Xplore Digital Library
Author	Kim, J.J. Heegon Kim Sunkyu Kong Jung, D.H. Joungho Kim Jiseong Kim Hajin Sung
Copyright Year	2012
Description	Author affiliation: Department of Energy Efficiency, Ministry of Knowledge Economy, Gwacheon, South Korea (Hajin Sung) \|\| Department of Electrical Engineering, KAIST, Daejeon, South Korea (Kim, J.J.; Heegon Kim; Sunkyu Kong; Jung, D.H.; Joungho Kim; Jiseong Kim)
Abstract	The importance of current detection has been highlighted with the introduction of 3D-IC, in order to ensure the safe and reliable operation of analog circuits in mixed-signal systems. In this paper, we propose toroidal current probe embedded in multi-layer printed circuit boards (PCBs) for current detection. Current is magnetically coupled to the proposed current probe and the transfer impedance between the port of injected current and the proposed current probe is used for the analysis of current coupling and current reconstruction. Through time- and frequency-domain experimental measurements with test vehicles on multilayer PCBs, we verified that the proposed current probe can accurately detect current signals. The proposed current probe does not influence the original current path, yet achieves high accuracy with a compact size by using a toroidal array of vias that surrounds the current path.
Starting Page	153
Ending Page	156
File Size	806930
Page Count	4
File Format	PDF
ISBN	9781467325394
e-ISBN	9781467325387
e-ISBN	9781467325370
DOI	10.1109/EPEPS.2012.6457866
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-10-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Probes Current measurement Frequency domain analysis Clocks Vehicles Integrated circuit modeling signal reconstruction current probing inductive coupling
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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