NDLI: FlashSoldering update-extending fine magnet wire joining applications

Content Provider	IEEE Xplore Digital Library
Author	Steinmeier, D.W. Becker, M.
Copyright Year	1999
Description	Author affiliation: Micro Joining Solutions, USA (Steinmeier, D.W.)
Abstract	FlashSoldering was first developed in 1998 as a new innovative, non-contact, localized reflow soldering process for terminating fine insulated copper magnet wires to electronic contacts without first removing the wire insulation. Subsequent research in 1999 has extended FlashSoldering applications from miniature magnetic component packages to soldering insulated single and multiple magnet wires and Litz wire to high-speed data connectors and other forms of electronic contacts. Quality issues concerned with copper-tin intermetallic growth and what happens to the magnet wire insulation during FlashSoldering were successfully resolved. Applications for FlashSoldering have broadened to include: single and multiple toroidal transformer packaging; LAN filters; low power DC-DC converters; single or multiple form coils and inductors; woven or braided high speed data cables; and connecting a single wire to a Litz wire bundle.
Starting Page	39
Ending Page	46
File Size	1355506
Page Count	8
File Format	PDF
ISBN	0780357574
ISSN	03622479
DOI	10.1109/EEIC.1999.826177
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-10-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Wire Toroidal magnetic fields Cable insulation Power transformer insulation Magnetic separation Contacts Electronics packaging Reflow soldering Copper Connectors
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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