NDLI: Boron nitride based poly (phenylene sulfide) compsoites with enhanced thermal conductivity and breakdown strength

Content Provider	IEEE Xplore Digital Library
Author	Xingyi Huang Wenhao Liu Pingkai Jiang Tanaka, T.
Copyright Year	2011
Description	Author affiliation: Grad. Sch. of Inf., Production & Syst., Waseda Univ., Kitakyushu, Japan (Tanaka, T.) \|\| Shanghai Key Lab. of Electr. Insulation & Thermal Aging, Shanghai Jiao Tong Univ., Shanghai, China (Xingyi Huang; Wenhao Liu; Pingkai Jiang)
Abstract	Dielectric polymer composites with high thermal conductivity and high breakdown strength have wide applications in electronic devices and electrical equipment. In this study, poly (phenylene sulfide) [PPS] and boron nitride (BN) were selected for preparing high thermal conductivity composites for high temperature insulation application. The composites were prepared by melt compounding to contain 0-40.0 wt% (BN). Laser flash method was used to measure the thermal conductivity. As a result, the composites exhibit significantly enhanced thermal conductivity when compared with the pure polymer. For instance, the composite sample shows an increase of thermal conductivity from 0.28 W/(m·K) (the pure PPS) to 1.21 W/(m·K) when it contains 40.0 wt% BN. Weibull statistical distribution was used to analyze the breakdown data and the characteristic breakdown strength was used to compare the breakdown strength of various samples. It was found that, except the sample containing the low concentration of BN filler, the composites show enhanced breakdown strength when compared with the pure PPS. Scanning electron microcopy (SEM) results show that the BN flakes are homogeneously distributed in the PPS matrix. Thermogravimetric analysis shows that the composites have increased thermal stability when compared with the pure PPS.
Starting Page	35
Ending Page	38
File Size	2073845
Page Count	4
File Format	PDF
ISBN	9784886860743
e-ISBN	9784886860743
DOI	10.1109/ISEIM.2011.6826270
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-09-06
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	The Institute of Electrical Engineers, Japan
Subject Keyword	Thermal conductivity Conductivity Electric breakdown Polymers Thermal stability Electronic packaging thermal management Insulation breakdown srength boron nitride polyphenylene sulfide thermal conductivity
Content Type	Text
Resource Type	Article

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