NDLI: Modelling the insulation displacement process-Results of a Finite-Element Model study-

Content Provider	IEEE Xplore Digital Library
Author	Jorgens, S. Taschke, H.
Copyright Year	2006
Description	Author affiliation: LumbergConnect GmbH&Co.KG, Schalksmuhle (Jorgens, S.; Taschke, H.)
Abstract	When considering the atmosphere of continuously growing pressure on time and costs in all areas of industry, it is clear that numerical simulations will increasingly dominate the development phase. In the final analysis, numerical methods will increase product and development quality and reduce the time and costs associated with testing. This trend has also become established in the field of connector design - and in this field in particular. The classic problems with regard to mechanical and thermal stability of contact carriers, the electrical and thermal stability of contact elements as well as their mutual coupling (multiphysics) are successfully processed with the help of the finite element method (FEM). This method has also lately been used to influence both the insulation displacement process as well as the design of the cutting elements (for the corresponding connectors). Within the context of this contribution to the conference, we will first offer a short overview of insulation displacement technology before we will discuss methods to predict the properties of IDT- connections during the development and the pre-production phase. The work presented here was focussed on the application of reasonable simulation approaches. The simulation results gained will be summarised and discussed comprehensively, including the general problems arising, in order to better understand the insulation displacement process and to deduce improved modelling approaches, which will be necessary to simulate IDT-connections both qualitatively and quantitatively in a correct manner. The simulation results will be compared with the metrologically determined values in order to describe the possibilities as well as the limits that the various model approaches have to offer. Furthermore first approaches for stranded wires and an example of use will be presented.
Sponsorship	IEEE
Starting Page	217
Ending Page	224
File Size	10316371
Page Count	8
File Format	PDF
ISBN	1424405815
DOI	10.1109/HOLM.2006.284090
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-09-25
Publisher Place	Canada
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Insulation Finite element methods Atmospheric modeling Costs Connectors Thermal stability Contacts Atmosphere Numerical simulation Testing friction component Insulation Displacement Technology conductors conductor assembly Finite Element Method design process von Mises' stress sliding
Content Type	Text
Resource Type	Article

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