NDLI: Au-Sb and Au-Ag-Sb alloys as low-voltage contact materials

Content Provider	IEEE Xplore Digital Library
Author	Bor-Jenq Wang Saka, N. Rabinowicz, E.
Copyright Year	1993
Description	Author affiliation: MIT, Cambridge, MA, USA (Bor-Jenq Wang; Saka, N.; Rabinowicz, E.)
Abstract	A recent investigation has shown that the increase in contact resistance of low-voltage noble-metal electrical contacts with the number of on-off switch cycles is primarily due to carbon build-up on the contact surfaces. Moreover, when the contact electrodes are made of base metals, such as Ni, Fe, Ti and Sb, carbon formation can be delayed, if not eliminated. Among these metals, Sb has been found to be the best contact material against carbon formation. Because of the comparatively higher electrical resistivity and the potential for oxidation, however, Sb cannot be used as a contact material. Therefore, it has been decided to alloy noble metals, such as Au and Ag, with Sb. In this study, Au-Sb and Au-Ag-Sb alloys of various compositions were prepared and tested in air-benzene mixture at room temperature. An impact tester was used for conducting tests that simulate the operation of relay contacts with electrical load. Of all the alloys tested for discouraging carbon formation, the Au-7 Ag-30 Sb alloy was found to be the best.
Starting Page	283
Ending Page	291
File Size	1078561
Page Count	9
File Format	PDF
ISBN	0780312708
DOI	10.1109/HOLM.1993.489688
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1993-09-27
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Tin alloys Testing Switches Gold alloys Contact resistance Surface resistance Electrodes Iron Delay Inorganic materials
Content Type	Text
Resource Type	Article

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