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Content Provider | IEEE Xplore Digital Library |
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Author | Kataoka, K. Inoue, K. Itoh, T. Suga, T. |
Copyright Year | 2007 |
Description | Author affiliation: Tokyo Electron AT Ltd., Nirasaki (Kataoka, K.) |
Abstract | We report on the contact process utilizing fritting phenomena between Al electrode and probes made of tin or tin gold alloy. The contact method with low contact force on Al electrodes is required for test probing of LSI for the next generation. The test probes made of tungsten or nickel are suitable for making contact with mechanical breaking of aluminum oxide. However, when these hard probes are used for fritting contact process, aluminum debris adheres to the probes and the contact failure occurs after several hundred contacts. In order to solve this problem, the low-force contact properties of soft probes are investigated in this paper. It was found that the mixture or alloy of tin and aluminum is generated in the contact area and remains on both the probe and the aluminum electrode after breaking the contact. Moreover, the probe made of tin-gold alloy is found to accumulate less aluminum debris and the contact resistance remains lower than 10 Omega after 1,000 contacts. |
Starting Page | 151 |
Ending Page | 155 |
File Size | 1482994 |
Page Count | 5 |
File Format | |
ISBN | 1424408377 |
DOI | 10.1109/HOLM.2007.4318209 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2007-09-16 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Probes Electrodes Tin Testing Aluminum alloys Gold alloys Large scale integration Tungsten Nickel Aluminum oxide tin-gold alloy aluminum oxide low-force contact fritting contact LSI probing tin |
Content Type | Text |
Resource Type | Article |
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