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Content Provider | IEEE Xplore Digital Library |
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Author | Yakovlev, E.V. Markov, A.B. Petrov, V.I. |
Copyright Year | 2012 |
Description | Author affiliation: Institute of High Current Electronics SB RAS, Akademichesky Ave. 2/3, Tomsk 634055, Russia (Yakovlev, E.V.; Markov, A.B.; Petrov, V.I.) |
Abstract | The electrical and tribological properties of multicomponent surface alloys (stainless steel (SS)-Cu) formed on copper substrate with a low-energy (20–30 keV) high-current (10–30 kA) electron beam (LEHCEB) of microsecond pulse duration (2–4 μm) have been investigated. Formation of surface alloys has been performed using deposition of SS films by means of magnetron sputtering followed by a LEHCEB liquid-phase mixing. A thickness of formed SS-Cu alloys was ranging from 1 to 10 μm. Investigation of properties of copper electrodes with SS-Cu alloy at the surface showed almost three times increase in the electrical strength of vacuum insulation (1 MV/cm) compared with that for initial copper electrodes (0.35 MV/cm). The reached electrical strength of vacuum insulation appear to be close to that for electrodes made of SS. Moreover, scratch tests revealed the significant improving of adhesion of coating to a substrate for surface alloys compared with that for the magnetron deposited coating. |
Starting Page | 568 |
Ending Page | 571 |
File Size | 1423839 |
Page Count | 4 |
File Format | |
ISBN | 9781467312639 |
ISSN | 10932941 |
e-ISBN | 9781467312660 |
e-ISBN | 9781467312653 |
DOI | 10.1109/DEIV.2012.6412583 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2012-09-02 |
Publisher Place | Russia |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Surface treatment Copper Electrodes Insulation Surface topography Steel |
Content Type | Text |
Resource Type | Article |
Subject | Computer Networks and Communications Software |
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